A new manufacturing technology has been developed for the continuous production of large-area flexible printed circuit boards (FPCBs). As demand grows for lightweight and long flexible cables capable of replacing conventional heavy wire harnesses amid the increasing size of electric vehicle batteries, this research establishes a foundation for the stable production of large-area circuit boards through a continuous manufacturing process. In particular, by quantitatively analyzing the behavior of bonding materials under various process conditions, the study provides a basis for future expansion into data-driven process optimization and AI-integrated automation technologies.
A research team led by Senior Researcher Dr. Jun Sae Han at the Nano Lithography and Manufacturing Research Center, Nano-Convergence Research Division, Korea Institute of Machinery and Materials (KIMM, President Seog-Hyeon Ryu), has proposed a roll-to-roll (R2R)-based direct roll lamination process. This method enable continuous material pressing allowing for efficient and scalable manufacturing.
The research team quantitatively analyzed how semi-cured adhesive films fill the gaps between circuit patterns under various process conditions, including speed and pressure. As a result, they identified conditions that enable stable filling even in continuous manufacturing environments. In particular, the team systematically characterized the “filling behavior” of adhesive materials based on process variables, providing a basis for data-driven process optimization.
Conventional sheet-type hot-press processes rely on one-by-one pressing, which limits the fabrication of long-length circuit boards. In contrast, this study presents a continuous manufacturing approach for large-area and long-length production. It also shows how filling behavior changes depending on key process conditions, helping define conditions for stable large-scale production.
This technology can be applied to the manufacturing of flexible sensing cables for next-generation mobility applications. It can contribute to reducing the weight of electric vehicles and improving production efficiency. In addition, it shows potential for expansion into packaging processes for large-area electronic devices, including semiconductors, displays, and extended reality (XR) devices. As process data accumulates, it is expected to further develop into AI-based automation technologies.
Senior Researcher Dr. Jun Sae Han stated, “This study demonstrates the feasibility of packaging long-length FPCBs using a continuous process,” adding, “We plan to expand its applications across various electronic devices and further develop it into intelligent and autonomous manufacturing technologies by integrating process monitoring and non-destructive inspection techniques.”
The research team is pursuing domestic patent applications and registrations for this continuous packaging technology. The study was also featured as a Supplementary Cover in ACS Applied Materials & Interfaces, a journal of the American Chemical Society.
Paper title: “Scalable Roll-to-Roll Approach for Encapsulating Long-Length Flexible Printed Circuit Boards”
This research was conducted as part of the Technology Innovation Program funded by the Ministry of Trade, Industry & Energy (MOTIE, Korea), the Basic Science Research Program by the Ministry of Science and ICT (MSIT, Korea), and the Basic Research Program of KIMM
